Alliance Memory announced that its synchronous DRAM (SDRAM) portfolio now features a wide variety of components that provide an automotive temperature range of -40° to +105 °C and are fabricated and assembled to automotive quality standards.

Alliance Memory offers a complete lineup of high-speed CMOS SDRAMs, including double data rate (DDR), DDR2, and DDR3 devices. The company’s portfolio of SDRAMs in the automotive temperature range includes components with densities of 64 Mb, 128 Mb, and 256 Mb. Automotive DDR1 SDRAMs feature densities of 128 Mb, 256 Mb, and 512 Mb, while DDR2 devices are available in densities of 256 Mb, 512 Mb, and 1 G. Alliance Memory’s 1-Gb, 2-Gb, and 4-Gb automotive DDR3 SDRAMs operate over 1.35-V and 1.5-V power supplies.

“Automotive customers need to be able to count on both the quality and the longevity of the memory components they design into key systems, which often need to be readily available years after the original design-in phase,” said David Bagby, president and CEO at Alliance Memory. “Our commitment to the automotive market includes contracting with ISO/TS 16949 certified fab and assembly facilities around the world, as well as ensuring that the key AEC-Q101-qualified components customers need will be available to them far into the future.”

Selected automotive 40°C~105°C temperature DRAM products available from Alliance Memory:

Part number Configuration Clock rate
DDR3 AS4C256M16D3A-12BAN
DDR3 AS4C128M16D3A-12BAN
DDR2 AS4C64M16D2-25BAN 1G

Orion Fans Cross References To NMB Product Discontinuations

56 New Fans & Blowers to Solve EOL Events

Orion Fans has expanded its DC fan and blower product listing to offer a viable, long-term source for customers when they face End-of-Life or product discontinuation notices. Orion Fans has introduced 52 new DC fans and 4 new DC blowers. The additions to the DC fan and blower families include a wide range of package size, speed (RPM), airflow (CFM), and special function combinations. For a stable source of supply, find the Orion Fans cross below.

NMB Part # Orion Fans Pt#   (mm) Voltage  
1004KL-01W-B40-B00 OD2510-05LB 25 x 25 x 10 5
1004KL-01W-B50-B00 OD2510-05MB 25 x 25 x 10 5
1004KL-04W-B30-B00 OD2510-12LLB 25 x 25 x 10 12
1004KL-04W-B40-B00 OD2510-12LB 25 x 25 x 10 12
1004KL-04W-B50-B00 OD2510-12MB 25 x 25 x 10 12
1004KL-04W-B59-B00 OD2510-12MB02A 25 x 25 x 10 12
1204KL-01W-B50-B00 OD3010-05MB 30 x 30 x 10 5
1204KL-01W-B59-B00 OD3010-05MB02A 30 x 30 x 10 5
1204KL-04W-B50-B00 OD3010-12MB 30 x 30 x 10 12
1204KL-04W-B59-B00 OD3010-12MB02A 30 x 30 x 10 12
1404KL-01W-B30-B00 OD3510-05LLB 35 x 35 x 10 5
1404KL-01W-B50-B00 OD3510-05MB 35 x 35 x 10 5
1404KL-01W-B59-B50 OD3510-05MB01A 35 x 35 x 10 5
1404KL-04W-B30-B00 OD3510-12LLB 35 x 35 x 10 12
1404KL-04W-B50-B00 OD3510-12MB 35 x 35 x 10 12
1404KL-04W-B59-B00 OD3510-12MB02A 35 x 35 x 10 12
1606KL-01W-B30-L00 OD4015-05LB 40 x 40 x 15 5
1606KL-01W-B50-L00 OD4015-05HB 40 x 40 x 15 5
1606KL-01W-B59-L00 OD4015-05HB02A 40 x 40 x 15 5
1606KL-04W-B30-L00 OD4015-12LB 40 x 40 x 15 12
1606KL-04W-B40-L00 OD4015-12MB 40 x 40 x 15 12
1606KL-04W-B50-L00 OD4015-12HB 40 x 40 x 15 12
1606KL-04W-B59-L00 OD4015-12HB02A 40 x 40 x 15 12
1606KL-05W-B30-L00 OD4015-24LB 40 x 40 x 15 24
1606KL-05W-B50-L00 OD4015-24HB 40 x 40 x 15 24
1606KL-05W-B59-L00 OD4015-24LB02A 40 x 40 x 15 24
2004KL-01W-B40-B00 OD5010-05LB 50 x 50 x 10 5
2004KL-01W-B50-B00 OD5010-05MB 50 x 50 x 10 5
2004KL-01W-B59-B00 OD5010-05MB02A 50 x 50 x 10 5
2004KL-04W-B30-B00 OD5010-12LB 50 x 50 x 10 12
2004KL-04W-B50-B00 OD5010-12MB 50 x 50 x 10 12
2004KL-04W-B59-B00 OD5010-12MB02A 50 x 50 x 10 12
2106KL-04W-B50-L00 OD5015-12HB 50 x 50 x 15 12
2106KL-04W-B59-L00 OD5015-12HB02A 50 x 50 x 15 12
2404KL-04W-B50-B00 OD6010-12HB 60 x 60 x 10 12
3106KL-04W-B30-B02 OD8015-12MB 80 x 80 x 15 12
3106KL-04W-B39-B00 OD8015-12MB02A 80 x 80 x 15 12
3106KL-04W-B40-B00 OD8015-12HB 80 x 80 x 15 12
3106KL-04W-B50-B01 OD8015-12HB 80 x 80 x 15 12
3106KL-04W-B59-B00 OD8015-12HB02A 80 x 80 x 15 12
3106KL-04W-B59-B50 OD8015-12HB01A 80 x 80 x 15 12
3106KL-05W-B30-B00 OD8015-24MB 80 x 80 x 15 24
3106KL-05W-B50-B00 OD8015-24HB 80 x 80 x 15 24
3106KL-05W-B59-B00 OD8015-24HB02A 80 x 80 x 15 24
3112KL-04W-B40-E00 OD8032-12MB 80 x 80 x 32 12
3112KL-04W-B50-E00 OD8032-12HB 80 x 80 x 32 12
3112KL-04W-B69-E00 OD8032-12HHBO2A 80 x 80 x 32 12
3112KL-05W-B30-E00 OD8032-24LB 80 x 80 x 32 24
3112KL-05W-B40-E00 OD8032-24MB 80 x 80 x 32 24
3112KL-05W-B50-E00 OD8032-24HB 80 x 80 x 32 24
3112KL-05W-B60-E00 OD8032-24HHB 80 x 80 x 32 24
3112KL-05W-B69-E00 OD8032-24HHB02A 80 x 80 x 32 24
3615KL-04W-B40-E00 OD9238-12MB 92 x 92 x 38 12
3615KL-05W-B50-E00 OD9238-24HB 92 x 92 x 38 24
3615KL-05W-B59-P00 OD9238-24HB02A 92 x 92 x 38 24
4712KL-04W-B50-P00 OD1232-12HB 120 x 120 x 32 12
4712KL-05W-B30-P00 OD1232-24LB 120 x 120 x 32 24
4712KL-05W-B49-P00 OD1232-24MB02A 120 x 120 x 32 24
4712KL-07W-B30-P00 OD1232-48LB 120 x 120 x 32 48
4712KL-07W-B49-P00 OD1232-48MB02A 120 x 120 x 32 48
BM5115-04W-B30-L00 ODB5115-12LB 51 x 15 12
BM5115-004W-B40-L00 ODB5115-12MB 51 x 15 12
BM5115-04W-B50-L00 ODB5115-12HB 51 x 15 12
BM6015-04W-B59-L00 ODB6015-12HHB02A 60 x 15 12

Additional Orion Fans Cross Reference Charts

Power Line Chokes Axial From Central Technologies

CTH8HCF Series From 3.9μH to 150,000μH

Description: Axial leaded power line inductor (UL sleeved).

Applications: Used in switching regulators, power amplifiers,

power supplies, SCR and TRIAC controls, speaker crossover

networks and filters.

Operating Temperature: -55°C to +125°C

Isat: DC current that will cause inductance to drop by 5%.

Irms: Based on the inductance change within 10% of initial value

and temperature rise of initial value less than 30°C within coil body.

Inductance Tolerance: ±10%

Testing: Inductance is tested on an HP4284A at 1KHz.

Packaging: Tape & reel.

Marking: Parts are marked with inductance code.

Miscellaneous: RoHS Compliant.

Additional Information: Additional electrical & physical

information available upon request.

Samples available.

Automotive Fuses Advancements


Automotive electronics engineers need to meet stringent automotive reliability standards for high-stress applications such as engine controls and battery-management systems. Automotive surface-mount fuses, located under the dashboard in a fuse box, are the go-to choice fault protection. Of these fuses, two types are most commonly used: solid body (chip) fuses or wire-in-air fuses.

However, not only are surface-mount fuses different, those that are commonly used can have major drawbacks. For instance, the non-uniform performance of printed-circuit style ceramic fuses can lead to internal connection failure caused by mechanical/thermal stress (vibration or bending), or by common soldering defects (cold joints or poor wetting). This type of failure can lead to damage to the circuit board and surrounding components.

This article describes the trends in automotive electronics driving the need for more reliable surface-mount fuses, and explains why using conventional fuses to protect automotive applications can fall short. For a solution, it presents advancements in ceramic and wire-in-air surface-mount fuses designed to specifically address the AEC-Q200 automotive standard. It also shows results from simulation tests that illustrate the significant advantages of using advanced technology over the traditional approaches.

Evolution in Surface-Mount Fuse Technology

As cars get “smart” and “connected,” more and more embedded and distributed electronics require pc-board-mounted circuit protection. And with the rapid emergence of electric (EV) and hybrid electric (HEV) vehicles – most with high energy lithium battery systems – the demand for reliable circuit protection devices to protect against catastrophic failures is critical.

While most automobiles (and commercial vehicles, for that matter) provide passengers with a comfortable environment, automotive applications for electronics are subjected to among the harshest of environments – wide temperature variations, shock and vibration, exposure to humidity, water and salt. These applications have placed emphasis on the need for improving surface-mount fuse technology. Fortunately, advancements in both chip and wire-in-air fuse technology is offering dramatically better reliability results over traditional solutions.

Chip Fuses

Traditional Approach: Printed-Circuit Style Chip Fuse

The structure of a conventional printed-circuit style of solid body fuse has a single-layer fuse element. The photomicrograph in Figure 1 shows how the printed-circuit structure is mainly composed of the epoxy substrate and glass. The fuse element is bonded to the surface of the pc board and coated with a protective polymer.

Figure 2 shows the result of a printed-circuit style chip fuse that was placed under high-current overload test conditions. As can happen with this type of chip fuse, the fuse element vaporized, causing prolonged arcing that led to surface melting, cracking and compromised mechanical integrity.

New Approach: Multi-layer Ceramic Chip Fuse

The other most common type of chip fuse is the multi-layer ceramic fuse. Figure 3 shows how the ceramic fuse’s co-fired monolithic structure has two layers of fusible material embedded in the structure.

The ceramic type of fuse offers several distinct advantages for automotive-grade applications since its monolithic structure it is capable of higher current ratings in a smaller package, plus it has a wider operating temperature and can maintain stable operating characteristics in extreme conditions.

A new advancement in ceramic fuse technology is the SolidMatrix ceramic fuse (Figure 4). This solid-body ceramic fuse utilizes a proprietary, solderless end cap construction and provides excellent mechanical and thermal stability over a wide temperature range (-55°C to +150°C).
An important comparison between the two types of chip fuses is how they react mechanically to a fault condition. Where the printed-circuit style fuse can experience arcing and damage during exposure to fault conditions, the multi-layer structure ceramic fuses are able to sustain their integrity.

For example, Figure 5 shows a SolidMatrix ceramic fuse after it was subjected to the same high-current stress conditions as the printed-circuit style fuse described in Figure 2. Unlike the damage sustained by the printed-circuit fuse’s single-layer fuse element, the SolidMatrix’s multi-layered fuse element is diffused into the ceramic body and the device’s appearance shows no external damage

Wire-in-Air Fuses

Traditional Approach: Square Ceramic Tube Fuse

The conventional wire-in-air fuse is known as the square ceramic tube fuse, or square nano fuse. The image Figure 6 shows the common construction for this type of fuse wherein the fusible wire element is housed inside a ceramic tube and connected to the endcaps with solder beads.
There are several disadvantages associated with this conventional wire-in-air fuse. Endcap detachment is a common failure mode in its construction. Also, there is a lack of uniformity in performance due to the variability in the placement of the wire element inside the ceramic tube.

In a worse-case scenario, high-current/heat causes the solder to vaporize, pressure builds up and the fuse erupts/opens. Once this occurs, the temperature goes down, the solder condenses and is redeposited across the circuit where it presents a potential short-circuit condition.

Figure 7 shows two conventional wire-in-air fuses subjected to an EV short circuit condition. Sample A at 250V/250A (left image) and Sample B at 450V/450A exhibited significant damage to the fuse and collateral damage to the surrounding circuitry. In the waveforms, the current flow (yellow trace) through the fuses each display secondary current flow that ultimately resulted in pc board damage.

New Approach: AirMatrix Fuse

A new performance wire-in-air fuse, the AirMatrix, uses a proprietary, hermetically-sealed wire-in-air structure that assures consistent electrical performance (Figure 8).
The fuse element in the AirMatrix fuse is uniformly straight across the cavity and externally bonded to the endcap (Figure 9). Unlike the conventional square nano type fuse, with its ceramic body and solder connect design, the AirMatrix fuse uses a fiberglass-enforced body and solderless direct connect construction.
When subjected to the same EV battery short circuit as the square nano tube fuses described earlier in Figure 7, the AirMatrix fuse’s advanced construction withstood 450V/450A conditions without experiencing any external damage (Figure 10). Note how in the waveforms, the current flow (yellow trace) through the AirMatrix fuse drops to zero. The voltage (green trace) shows an open circuit for the AirMatrix fuse with no secondary conduction.


Automotive electronics engineers need to look past traditional chip and wire-and-air fuse solutions when setting out to qualify their devices for the AEC-Q200 standard. As shown in by testing results covered in this article, advancements in ceramic and wire-in-air fuses offer significant advantages over conventional approaches. Representing a new approach with significant advantages, the SolidMatrix multi-layer ceramic chip fuse and the AirMatrix wire-in-air fuse are designed in a TS16949-certified facility and are specifically designed for reliable operation in high-stress automotive applications.

For samples or questions , send is an email to or visit our shop.

Pin-For-Pin Replacements For Discontinued Micron Technology Devices Will Be Available For At Least Five Years

New Alliance Memory 512Mb SDRAMs in 54-Pin TSOP II Package Provide Pin-for-Pin Replacements for Discontinued Micron Technology Devices

Alliance Memory introduced two new 512Mb synchronous DRAMs (SDRAM) in the 54-pin TSOP II package. The AS4C32M16SB-7TCN and AS4C32M16SB-7TIN are available in commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges. The devices provide pin-for-pin replacements for Micron Technology’s discontinued 32M x 16 MT48LC32M16A2P-75:C (AS4C32M16SM-7TCN) and MT48LC32M16A2P-75 IT:C (AS4C32M16SM-7TIN) SDRAMs. Alliance Memory bought the remaining stock of these Micron Technology 512Mb SDRAMs in 2014.

“We are committed to making the transition to Alliance parts as easy as possible for Micron customers, with no gap in product availability,” said David Bagby, president and CEO of Alliance Memory. “We will continue to sell these SDRAMs with their Micron part numbers while stock lasts, and the Alliance-branded AS4C32M16SM-7TCN and AS4C32M16SM-7TIN will be available while supplies last. The AS4C32M16SB-7TCN and AS4C32M16SB-7TIN (“B die”) will be available for at least five years. The devices released today will provide a long-term solution, offering customers pin-for-pin-compatible replacements at a lower cost.”

The AS4C32M16SB-7TCN and AS4C32M16SB-7TIN are optimized for medical, industrial, point-of-sale, automotive, and telecom applications requiring high memory bandwidth. The devices operate from a single +3.3V (±0.3V) power supply, offer fast clock rates up to 143MHz, and are lead (Pb)- and halogen-free.

The SDRAMs provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximize performance.

Device Specification Table

Part number Pin-for-pin compatibility Clock rate (MHz) Temp. range
AS4C32M16SB-7TCN MT48LC32M16A2P-75:C
143 MHz 0 to 70
AS4C32M16SB-7TIN MT48LC32M16A2P-75 IT:C
143 MHz -40 to 85

Samples and production quantities of the AS4C32M16SB-7TCN and AS4C32M16SB-7TIN are available now, pls contact us or send us and email to

Alliance Memory Is Offering Designers A New Alternative And Shorter Lead Times For The Low Power Consumption They Require

Alliance Memory 16Gb Mobile LPDDR3 SDRAM Offers Low Power Consumption to Optimize Battery Life in Mobile Devices

Alliance Memory introduced a new high-speed CMOS mobile low-power DDR3 (LPDDR3) SDRAM designed to extend battery life in compact portable devices. Featuring low voltage operation of 1.2V/1.8V and a number of power-saving features, the 16Gb AS4C512M32MD3 is offered in the 11.0mm by 11.5mm 178-ball FBGA package.

With each new product generation, designers of mobile devices such as smartphones, tablets, and virtual and augmented reality (VR and AR) headsets are tasked with providing more functionality in less space while using less power. To meet this demand, the LPDDR3 device released today features auto temperature-compensated self-refresh (TCSR) to minimize power consumption at lower ambient temperatures. In addition, its partial-array self-refresh (PASR) feature reduces power by only refreshing critical data, while a deep power down (DPD) mode provides an ultra-low power state when data retention isn’t required.

Reducing IC power consumption can directly increase battery life in portable devices, so the applications for LPDDR3 SDRAMs in the consumer and mobile communication markets continue to grow. At the same time, the number of suppliers for these devices is decreasing. Alliance Memory is offering designers a new alternative and shorter lead times for the low power consumption they require. Devices such as our new 16Gb AS4C512M32MD3 provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in high-bandwidth, high-performance memory system applications.

Manufactured using a 20nm process, the AS4C512M32MD3 is internally configured as 8 banks x 32 Mbit x 32. The device offers high-speed operation with a clock frequency of 667MHz and data rate of 1333Mbps, and it features an extended commercial temperature range of -25°C to +85°C. The LPDDR3 SDRAM offers fully synchronous operation and programmable read or write burst lengths of 4, 8, or 16. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh. The RoHS-compliant device is lead (Pb)- and halogen-free.

Custom Cooling Solutions For High Performance Applications And Harsh Environments

Orion Fans: We make it easy for you

Orion Fans has the most extensive line of AC fans, DC fans, fan trays, fan accessories and blowers. With the quickest response, largest available fan inventory, shortest lead times and competitive pricing, Orion Fans will deliver the exact cooling solution you need, faster than anyone.

Custom cooling solutions for high performance applications and harsh environments

When your design requires something special, whether it’s an AC fan, DC fan or fan tray, Orion Fans will meet your needs fast… from pricing to prototype to production.

Application-specific fans including dual-voltage, spot cooling, sealed sleeve, low-noise, water-proof, high performance, thermal controlled
In-house engineering support
Value-added services and capabilities

GPS Active Embedded Microstrip Antennas

Finding the ideal antenna configuration to ensure a systems wireless reception can be a challenge. Our engineering team can help identify important issues that will influence the antennas efficiency such as ground plane size, mounting methods, board layout and port measurement. We will assist customers to determine which microstrip antenna is ideal for the customers design by reviewing the gain, frequency tolerance, impedance matching and polarization and radiation patterns.

We can also validate the performance of the antenna with the customers design by utilizing our on-site SATIMO anechoic chamber. We have the engineering capabilities to easily accommodate any required adjustments in order to deliver a fully optimized antenna. Our microstrip antenna designs can be customized to meet your required specifications. Contact us for a complete list of available customizations.


GPS L1 frequency
Active LNA circuitry
Compact size
Custom tuning
Custom connector/Cable size


Vehicle and fleet tracking
Military & security
Asset tracking
Embedded applications
Oil & gas industries
Navigation devices
Mining equipment
LBS & M2M applications
Handheld devices
Law enforcement

Hi-Rel Fuses

AEM, Inc. thick film fuses are produced for the aerospace industry in AEM’s MIL-STD-790 / AS9100 facility in San Diego, CA. AEM’s fuses have been selected by most major space programs and have been in orbit for the past 35-plus years with zero reported failures. AEM, Inc. is the sole QPL listed manufacturer of FM12/P600L series solid body fuses.

AEM’s High Reliability Solid Body Fuses



Thick film fusible element construction with glass arc suppressing system
Designed and screened specifically for high reliability applications where failure is not an option
QPL approved to MIL-PRF-23419/12
Manufactured and screened entirely in AEM’s San Diego Facility
Material and process traceability maintained for all fuse products (Group A and B screening and data standard)
Supplied with gold plated or Sn/Pb terminal finishes


Operating temperature range of -55ºC to +125ºC
Consistent minimum and maximum clearing times at overload currents regardless of vacuum conditions
Solid body construction not subject to the de-rating factors of MIL-STD-975
Solid body construction able to withstand greater vibration and shock exposure without damage
Positive temperature coefficient of fusible element causing resistance to increase (prior to opening) preventing absolute short circuit to the power source
Internal construction ensuring that arc, plasma, and vapor contained within the fuse package during clearing process
Reliability plans for fuse products including ongoing 2000 hour life testing with over 10,000,000 life test hours completed with no failures reported


Military and commercial satellites and spacecraft
Protection of power supplies, batteries, and solar arrays
Isolation of redundant and branch circuits
Short circuit protection of squib and jettison circuitry
Available in matched set configurations for higher current applications

Fuse Selection Considerations

Applied DC voltage level
Steady-state operating current level
Ambient temperature/ PCB mount temperature
Potential overload current levels and length of time at which fuse must open
Surge in-rush and/or pulse currents
Lead configuration required: radial, formed, surface mount, and flexible or solid leads

Fuse Model Options


  • QPL listed to MIL-PRF-23419/12

    DC voltage ratings of 50V, 72V, and 125V

    Current ratings of 1/8A to 20A as single fuses

    Matched sets available for higher current requirements

    Formed, straight, and solder coated terminal options

    Overload interrupt and clearing time

characteristics specified at 250%, 400%, and 600% levels  


Commercial version of the QPL FM12 series fuses

DC voltage ratings of 50V, 72V, 125V, 135V, and higher (consult factory)

Current ratings of 1/8A to 20A as single fuses

Matched sets available for higher current requirements

Straight, flexible, and solder coated terminal options

Overload interrupt and clearing time characteristics specified at 250%, 400%, and 600% levels 


Surface mountable version

Available on tape & reel for automated manufacturing processes

Internal solder either standard (Sn96/Ag4

(P700L) or high temp (Sn10/Pb88/Ag2


DC voltage ratings of 50V, 72V, 125V, and higher (consult factory)

Current ratings of 1/8A to 20A as single fuses

Matched sets available for higher current requirements

Wraparound reverse “J” tab terminal for surface mounting

Overload interrupt and clearing time characteristics specified at 250%, 400%, and 600% levels



Slow blow version

Designed to operate with slower clearing times

DC voltages 72V and higher (consult factory)

Current ratings of 2A to 15A as single fuses

Matched sets available for higher current requirements

Straight and solder coated terminal options

Overload interrupt and clearing time characteristics specified at 250%, 400%, and 600% levels



Formed terminal version of the P600L fuse models

DC voltage ratings of 50V, 72V, 125V, 135V, and higher (consult factory)

Current ratings of 1/8A to 20A as single fuses

Matched sets available for higher current requirements

Modified radial lead configuration allows for alternate surface mount flexibility

Overload interrupt and clearing time characteristics specified at 250%, 400%, and 600% levels


Surface mount chip version (solid body construction)

EIA 1206 case size

DC voltages of 24V and 32V

Current ratings 1/4A to 7A as single fuses

Overload interrupt and clearing time characteristics specified at 250%, 400%, and 600% levels

Sn/Pb plated end terminations

For custom fuse model current ratings, voltage ratings, terminal finish, modules, and other alternate configurations, please contact the factory.




77% FOOTPRINT   48% VOLUME     78 %WEIGHT     


High Rel Mil grade Level SW single output SW equivalent

parts from three other suppliers were compared  on  size,   

volume, and weight. The MDI solution provided an average   

savings  over  alternate solutions. 



For Space Qual’d (100K Rad) Type single output 10W 

equivalent parts , the MDI solution provided an average 

savings  over  alternative  solutions.


With MD l ‘s Single Package approach , there is no post filter noise ingress point between filter output and the DC-DC converter input

as they are both contained (including a common mode output spike filter) wit h in the hermetically sealed shielded enclosure.


When adding the additional labor and indirect costs of building two parts , the MDI advantage becomes obvious .

Exceeds your SWAP-C Requirements here.