How Karl Kruse GmbH & CO KG Solves Obsolescence Issues For Electronic Industry

OEMs face the risk of electronic component obsolescence daily and we are aware that our customers have come to a avoid a disruption of the supply chain expect, “says Klaus Kruse, CEO of Karl Kruse GmbH & Co KG. For many years as an obsolescence specialist Karl Kruse GmbH & Co. KG works constantly on the optimisation of obsolescence strategies. In the focus stand solution attempts, beginning by the search of alternative components, 100% of retraceability of the components, up to the protection from obsolescence like read time Buy, EOL – and PCN service etc.

Karl Kruse offers alternative components of various manufacturers and is also an authorized distributor for Calogic and Tsingtek.

Calogic offers a range of reliable working and long-term available standard Replacement diodes, JFETs and MOSFETs. Especially the obsolete JFETs Vishay / Siliconix, there are of Calogic. Calogic designed and manufactures discrete and analog ICs for the use of automation, computers, instrumentation, medical applications, power management, Transportation and Telecommunications.

“We can offer a very successful alternative to the discontinued MOSFET BSS83 NXP locate and this have been able to qualify for the bill at our OEMs in the Automilbranche and industry. Even devices with wired enclosures, such as TO-92, there are still at Calogic” says Klaus Kruse

“The problems with displays we have known and have been working for approximately 1 year with great success with the company Tsingtek together. Our customers in the medical, industrial, air -and- space need for your products a minimum life of 5 years or more” says Klaus Kruse.

OLED, LCD, TFT and customized display solutions for industrial and commercial. Tsingtek is a leading provider of display products in China. Founded in 2002, Tsingtek uses the latest high-tech methods and processes to design and produce displays, ranging from a simple LCD alphanumeric component to more complex LCD and OLED graphics modules. Your use modern production COB, SMT, COG and TAB processes to assist in the production of standard and customized display modules containing many fonts, voltage, power and temperature options.

The focus of the products are application areas and target groups of customers with applications in automotive, measurement, analysis, medical, audio and video, energy, security, budgetary and water treatment technology, telecommunications and houseware and many more.

Iridium Solutions From Maxtena

Maxtena Iridium Solutions
Maxtena’s line of Iridium antennas are fully Iridium network certified and designed to compliment a wide range of applications, including fleet, asset & personal tracking, handheld devices, satellite telephony, utility monitoring, and more.

What do you need?

Helical Solution
Patch Solution
External Solution
Tracking/Fleet
Custom Solution

AEM Introduces Surface-Mount Fast-Acting Fuses For Low-Power Applications

AEM Introduces Surface-Mount Fast-Acting Fuses for
Low-Power Applications

Fiberglass enforced epoxy chip fuses combine low DCR, high inrush withstand
and fast clearing time; low current ratings and 0603 package ideal for portable electronics

SAN DIEGO, Calif. — Sept 2015— AEM Components introduces its latest series of fast-acting low-power SMD fuses. The new thin-film T0603FF Series, available with current ratings from 0.15A to 5A, combines high inrush capability with very fast clearing at 200% of rated current. The low-profile, 0603 packaged body is constructed with fiberglass enforced epoxy technology combined with nickel and tin-plated copper terminations. The T0603FF Series is ideally suited for battery-powered applications including notebook computers and tablets, cameras, toys, Bluetooth earphones, and other portable electronics devices.

Key Features:
• Ultra low DCR
• Current rating from 0.15A to 5.00A
• Low profile compact footprint (0603 package size) with thickness of as low as 0.3 mm
• Lead-free, Halogen and RoHS Applications:
• Battery-powered applications
• Notebook computer and tablets
• Cameras
• Toys
• Bluetooth earphones
• Portable devices

Go to: http://doc.aemcomponents.com/catalog/AEM_T0603FF.pdf to download technical data for the T0603FF Series

For samples pls contact us.

Embedded Antenna Solutions

Helical Antenna Integration
We really like helical antennas, and our Helicore antennas are ideal for custom integration.Unlike many helical antennas, Maxtena’s Helicore Technology allows for easy integration and embedding. We typically use a standard 3-prong connector for embedding purposes, but our helical antennas can be easily customized for integration.

GPS Patch Antenna Integration
We are experts when it comes to integrating GPS patch antennas into any housing.We are pretty familiar with patch antennas, and we know how to get the best integration for the best price point! We’ve got great tips and tricks for your to try, or we can assist directly with your integration.

Custom Connectors
Most of our off-the-shelf products can be tailored to your project! Our off-the shelf antennas are great for many applications, but sometimes SMA connectors don’t cut it. When that happens, just let us know! We are able to customize our products with most standard cables and connectors.

Contact Us

More infos you will find here.

NEW 8M LOW-POWER CMOS SRAM WITH 2.7-V TO 3.6-V POWER SUPPLY IN TSOP-I PACKAGE

Alliance Memory expanding their line of legacy low-power CMOS SRAMs with a new 8M IC (512K x 16 bit) in the 48-pin 12-mm by 20-mm TSOP-I package. Available from a very limited number of suppliers and recently discontinued by another manufacturer, the AS6C8016-55TIN operates from a single power supply of 2.7 V to 3.6 V and offers a fast access time of 55 ns.

The AS6C8016-55TIN features low power consumption with a typical operating current of 30 mA and standby current of 1.5 µA. The IC provides high reliability and power savings for low-power portable electronics and industrial, telecom, medical, automotive, and networking applications, and is particularly well-suited for battery backup non-volatile memory.

The AS6C8016-55TIN is fabricated using very high-performance, high-reliability CMOS technology, and its standby current is stable within the operating temperature range of – 40 °C to + 85 °C. The RoHS-compliant device offers fully static operation and tri-state output, and it features a data retention voltage of 1.2 V minimum. All inputs and outputs are fully TTL-compatible.

Read more …

New Generation Aluminum Electrolytic Capacitors

SHELCON has new generation Radial Aluminum Electrolytic Capacitors (E-CAP) named TiO2 Aluminum Electrolytic Capacitor (SHW / GXT / SYJ series). TiO2 Aluminum Electrolytic Capacitor is an innovative nano rare precious metal. It has excellent physical and chemical features, such as good and wide temperature working range, small size, low impedance at high frequency, enable to tolerate high reverse voltage in circuit, long life due to low deterioration to the surface of the TiO2 metal, able to sustain instantaneous high current surge, will not generate resistive coating. Wide applications in products that require small size, high ripple current and large capacitance. SHELCON, a Japanese manufacturer of the world smallest size, super Low ESR, high Ripple Current, high Temperature at +125°C/+130°C, super Low Temperature (-55°C) with ultra Long Life Time (up to 12000Hrs) Radial Aluminum Electrolytic Capacitors. We are offering HIGH QUALITY, LOWER PRICE, HIGH RELIABILITY, LOWER COMPETITIVE PRICE and SHORT LEAD TIME Aluminum Electrolytic Capacitor to fix your need. Major Application are DC-DC power supply units, AC-DC power supply units, LED power supply units, Router, Internet & Communication apparatus, mutli-function adaptor, mobile phone chargers … etc. Contact Karl Kruse today and you shall experience the difference.

Thin Battery With Bending Flexibility

Power Your Flexible Life FLCB (FPC Lithium-Ceramic Battery), is the worldwide first success of solid-like Li battery technology. FLCB breaks a new ground in Li-ion Battery about the battery appearance, technique, production process, features, and safety. FPC (Flexible Printed Circuit) and solid-like electrolyte were intrepidly adopted and achieve the possibility of Li-Battery’s thinning out, flexibility, and ultra-safety. The dangers of leakage, fire, or explosion are not issues anymore. Formable Mechanism of the FLCB also makes the High Flexibility of Product Design, including Flexible or Irregular Forming mode. FLCB provides access to a wide variety of markets, contributes significantly to the end product benefit and is difficult for competitors to imitate for its depth of technology Know-How.

FLCB Applications: Wearable: Smart Glasses/LED Hat/ LED Jacket/ Lighting Gloves /Smart Watches / Lighting Armband /Heating Shoes IOT: Active RFID /Smart Card/Functional Card /Logistic sensor /Recorder MEMS/ Smart Home Tubular Type: Electrical Cigarettes/Pens /Bluetooth Headset /Smart Glasses

Power your Flexible Life and contact us today.

Prevention Becomes More And More Important

Shorter and shorter product life cycles in the Consumer area have led to it, that also many industrially used electronics components already after one or two years are only difficult to get or not available anymore.
That an electronic component sometime is obsolete , would be nothing unusual, if not the product life cycles of the individual components and the final products would run ever further apart. For enterprises in industries like the military, railway, power station, automation and medical technology, where products must be as invariably as possible supplied over many years, both the production development and the cost calculation thereby more and more often to the tightrope act, stresses Klaus Kruse.
However in Germany the costs caused by obsolete components no longer available on the regular market move in the meantime in the three-figure million range. The damage caused by counterfeit components is not yet taken into this account. In the long run , if you are a manufacturer of long-lived industrial goods one will not come past arguing with the topic Obsolescence. “
As the most effective protection from unpleasant surprises by component obsolescence or changes – Klaus Kruse recommends changes already begin in the evaluation phase of a new product with the Obsolescence process. „ Argue before the development with the prospective availability duration of the necessary components and possible alternatives , afterwards every now and then very much money helps itself to save, because the additional exchange of individual components or complete Redesigns are just connected with high risks of costs “, Klaus Kruse means.
With the examination and evaluation components endangered by parts lists on risky obsolescent is mostly not yet done possibly however. The fact that there is not the one Obsolescence solution absolutely but for an effective Obsolescence strategy usually a whole set of measures is necessary.
Karl Kruse’s solutions range from complex components with integrated databases for discontinued forecast about international procurement management, Replacement-ICs, long time storage draughts, engineering, Rework and Electronic Manufacturing service to the aftermarket production discontinued
Components and development of customized Replacement ICs. „Our aim is to sensitize CEMS, manufacturer, distributors and the users stronger for this subject. There will never be the absolute protection from Obsolescence though, but many possibilities of the risk minimization of which we want to give an understanding and pass it to our customers .“

NEW MONOLITHIC HIGH-SPEED, LOW-VOLTAGE 1G X 8 CMOS DDR3L SDRAM IN 78-BALL FBGA

Alliance Memory introduces a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 78-ball, 9-mm by 13.2-mm, lead (Pb)-free FBGA package. Delivering increased power efficiency for high-end computer and storage systems, the 1G x 8 AS4C1G8MD3L offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.

Key Specifications and Benefits:

Internally configured as eight banks of 1G x 8 bits
Offered in the 78-ball, 9-mm by 13.2-mm FBGA package
Extremely fast transfer rates of up to 1600 Mbps/pin
Clock rates of 800 MHz
Operates from a single +1.35-V power supply
Available with an extended commercial temperature range of 0 °C to +95 °C (AS4C1G8MD3L-12BCN)
Fast 64-ms, 8192-cycle refresh from 0 °C to +85 °C and 32 ms from +85 °C to +95 °C
Fully synchronous operation
Programmable read or write burst lengths of 4 or 8
Auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence
Easy-to-use refresh functions include auto- or self-refresh
Programmable mode register allows the system to choose the most suitable modes to maximize performance
Lead (Pb)-free

Target Applications:

Industrial, medical, networking, telecom, and aerospace applications

DISCONTINUED MICRON SEMICONDUCTOR LEAD (PB)-BEARING DDR, DDR2, AND SDR SDRAMS Available

Karl Kruse is now selling Alliance Memorys and offer the following Micron Semiconductor lead (Pb)-bearing double data rate (DDR), double data rate 2 (DDR2), and single data rate (SDR) devices that Micron discontinued with Micron PCN #31396 (last time buy: April 15, 2015; last time ship: Nov. 30, 2015).

With the addition of these devices, Alliance Memory now offers a wide range of lead-bearing Micron devices, including 64M, 128M, 256M, and 512M SDR SDRAMs; 256M and 512M DDR SDRAMs; and 2G DDR2 SDRAMs. The devices are available in a variety of configurations, packages, and voltages, and are offered in commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges.

To order samples, please send E-mail to info@kruse.de

Micron Semiconductor Description
part number
MT46V16M16TG-5B:MTR DDR1, 256M, 16M X 16, TSOP, commercial temperature, leaded, tape-and-reel
MT46V16M16TG-5B IT:M DDR1, 256M, 16M X 16, TSOP, industrial temperature, leaded
MT46V32M16CV-5B IT:J DDR1, 512M, 32M X 16, 84 BGA, industrial temperature, leaded
MT46V32M16TG-5B IT:JTR DDR1, 512M, 32M X 16, TSOP, industrial temperature, leaded, tape-and-reel
MT46V32M16TG-5B IT:J DDR1, 512M, 32M X 16 TSOP, industrial temperature, leaded
MT46V64M8CV-5B IT:J DDR1, 512M, 64M X 8, 84-ball BGA, industrial temperature, leaded
MT47H128M8CF-3:H DDR2, 1G, 128M X 8, 1.8V, 60-ball BGA, 400MHZ, commercial temperature, ROHS
MT47H128M16PK-25E IT:C DDR2, 2G, 128M X 16, 84-pin BGA, industrial temperature, leaded
MT47H128M16PK-25E IT:CTR DDR2, 2G, 128M X 16, 84-pin BGA, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2F4-6A IT:GTR SDRAM, 256M, 16M X 16, 54-ball BGA, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2F4-6A:G SDRAM, 256M, 16M X 16, 54-ball BGA, commercial temperature, leaded
MT48LC16M16A2F4-6A:GTR SDRAM, 256M, 16M X 16, 54-ball BGA, commercial temperature, leaded, tape-and-reel
MT48LC16M16A2TG-6A IT:GTR SDRAM, 256M, 16M X 16, 54-pin TSOP, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2TG-6A:GTR SDRAM, 256M, 16M X 16, 54-pin TSOP, commercial temperature, leaded, tape-and-reel
MT48LC2M32B2TG-6A IT:J SDRAM, 64M, 2M X 32, TSOP, industrial temperature, leaded
MT48LC2M32B2TG-6A IT:JTR SDRAM, 64M, 2M X 32, TSOP, industrial temperature, leaded, tape-and-reel
MT48LC2M32B2TG-6A:J SDRAM, 64M, 2M X 32, TSOP, commercial temperature, leaded
MT48LC32M16A2TG-75:C SDR, 512M, 32M X 16, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature
MT48LC32M16A2TG-75:CTR SDR, 512M, 32M X 16, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature, tape-and-reel
MT48LC4M32B2TG-6A:L SDRAM, 128M, 4M X 32, TSOP, commercial temperature, leaded
MT48LC4M32B2TG-6A IT:L SDRAM, 128M, 4M X 32, TSOP, industrial temperature, leaded
MT48LC64M8A2TG-75 IT:C SDR, 512M, 64M X 8, 3.3 V, 54-pin TSOP II, 133 MHz, industrial temperature
MT48LC64M8A2TG-75:C SDR, 512M, 64M X 8, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature
MT48LC8M16A2TG-6A:L SDRAM, 128M, 8M X 16, TSOP, commercial temperature, leaded
MT48LC8M16A2TG-6A:LTR SDRAM, 128M, 8M X 16, TSOP, commercial temperature, leaded, tape-and-reel