Embedded Antenna Solutions

Helical Antenna Integration
We really like helical antennas, and our Helicore antennas are ideal for custom integration.Unlike many helical antennas, Maxtena’s Helicore Technology allows for easy integration and embedding. We typically use a standard 3-prong connector for embedding purposes, but our helical antennas can be easily customized for integration.

GPS Patch Antenna Integration
We are experts when it comes to integrating GPS patch antennas into any housing.We are pretty familiar with patch antennas, and we know how to get the best integration for the best price point! We’ve got great tips and tricks for your to try, or we can assist directly with your integration.

Custom Connectors
Most of our off-the-shelf products can be tailored to your project! Our off-the shelf antennas are great for many applications, but sometimes SMA connectors don’t cut it. When that happens, just let us know! We are able to customize our products with most standard cables and connectors.

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More infos you will find here.

NEW 8M LOW-POWER CMOS SRAM WITH 2.7-V TO 3.6-V POWER SUPPLY IN TSOP-I PACKAGE

Alliance Memory expanding their line of legacy low-power CMOS SRAMs with a new 8M IC (512K x 16 bit) in the 48-pin 12-mm by 20-mm TSOP-I package. Available from a very limited number of suppliers and recently discontinued by another manufacturer, the AS6C8016-55TIN operates from a single power supply of 2.7 V to 3.6 V and offers a fast access time of 55 ns.

The AS6C8016-55TIN features low power consumption with a typical operating current of 30 mA and standby current of 1.5 µA. The IC provides high reliability and power savings for low-power portable electronics and industrial, telecom, medical, automotive, and networking applications, and is particularly well-suited for battery backup non-volatile memory.

The AS6C8016-55TIN is fabricated using very high-performance, high-reliability CMOS technology, and its standby current is stable within the operating temperature range of – 40 °C to + 85 °C. The RoHS-compliant device offers fully static operation and tri-state output, and it features a data retention voltage of 1.2 V minimum. All inputs and outputs are fully TTL-compatible.

Read more …

New Generation Aluminum Electrolytic Capacitors

SHELCON has new generation Radial Aluminum Electrolytic Capacitors (E-CAP) named TiO2 Aluminum Electrolytic Capacitor (SHW / GXT / SYJ series). TiO2 Aluminum Electrolytic Capacitor is an innovative nano rare precious metal. It has excellent physical and chemical features, such as good and wide temperature working range, small size, low impedance at high frequency, enable to tolerate high reverse voltage in circuit, long life due to low deterioration to the surface of the TiO2 metal, able to sustain instantaneous high current surge, will not generate resistive coating. Wide applications in products that require small size, high ripple current and large capacitance. SHELCON, a Japanese manufacturer of the world smallest size, super Low ESR, high Ripple Current, high Temperature at +125°C/+130°C, super Low Temperature (-55°C) with ultra Long Life Time (up to 12000Hrs) Radial Aluminum Electrolytic Capacitors. We are offering HIGH QUALITY, LOWER PRICE, HIGH RELIABILITY, LOWER COMPETITIVE PRICE and SHORT LEAD TIME Aluminum Electrolytic Capacitor to fix your need. Major Application are DC-DC power supply units, AC-DC power supply units, LED power supply units, Router, Internet & Communication apparatus, mutli-function adaptor, mobile phone chargers … etc. Contact Karl Kruse today and you shall experience the difference.

Thin Battery With Bending Flexibility

Power Your Flexible Life FLCB (FPC Lithium-Ceramic Battery), is the worldwide first success of solid-like Li battery technology. FLCB breaks a new ground in Li-ion Battery about the battery appearance, technique, production process, features, and safety. FPC (Flexible Printed Circuit) and solid-like electrolyte were intrepidly adopted and achieve the possibility of Li-Battery’s thinning out, flexibility, and ultra-safety. The dangers of leakage, fire, or explosion are not issues anymore. Formable Mechanism of the FLCB also makes the High Flexibility of Product Design, including Flexible or Irregular Forming mode. FLCB provides access to a wide variety of markets, contributes significantly to the end product benefit and is difficult for competitors to imitate for its depth of technology Know-How.

FLCB Applications: Wearable: Smart Glasses/LED Hat/ LED Jacket/ Lighting Gloves /Smart Watches / Lighting Armband /Heating Shoes IOT: Active RFID /Smart Card/Functional Card /Logistic sensor /Recorder MEMS/ Smart Home Tubular Type: Electrical Cigarettes/Pens /Bluetooth Headset /Smart Glasses

Power your Flexible Life and contact us today.

Prevention Becomes More And More Important

Shorter and shorter product life cycles in the Consumer area have led to it, that also many industrially used electronics components already after one or two years are only difficult to get or not available anymore.
That an electronic component sometime is obsolete , would be nothing unusual, if not the product life cycles of the individual components and the final products would run ever further apart. For enterprises in industries like the military, railway, power station, automation and medical technology, where products must be as invariably as possible supplied over many years, both the production development and the cost calculation thereby more and more often to the tightrope act, stresses Klaus Kruse.
However in Germany the costs caused by obsolete components no longer available on the regular market move in the meantime in the three-figure million range. The damage caused by counterfeit components is not yet taken into this account. In the long run , if you are a manufacturer of long-lived industrial goods one will not come past arguing with the topic Obsolescence. “
As the most effective protection from unpleasant surprises by component obsolescence or changes – Klaus Kruse recommends changes already begin in the evaluation phase of a new product with the Obsolescence process. „ Argue before the development with the prospective availability duration of the necessary components and possible alternatives , afterwards every now and then very much money helps itself to save, because the additional exchange of individual components or complete Redesigns are just connected with high risks of costs “, Klaus Kruse means.
With the examination and evaluation components endangered by parts lists on risky obsolescent is mostly not yet done possibly however. The fact that there is not the one Obsolescence solution absolutely but for an effective Obsolescence strategy usually a whole set of measures is necessary.
Karl Kruse’s solutions range from complex components with integrated databases for discontinued forecast about international procurement management, Replacement-ICs, long time storage draughts, engineering, Rework and Electronic Manufacturing service to the aftermarket production discontinued
Components and development of customized Replacement ICs. „Our aim is to sensitize CEMS, manufacturer, distributors and the users stronger for this subject. There will never be the absolute protection from Obsolescence though, but many possibilities of the risk minimization of which we want to give an understanding and pass it to our customers .“

NEW MONOLITHIC HIGH-SPEED, LOW-VOLTAGE 1G X 8 CMOS DDR3L SDRAM IN 78-BALL FBGA

Alliance Memory introduces a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 78-ball, 9-mm by 13.2-mm, lead (Pb)-free FBGA package. Delivering increased power efficiency for high-end computer and storage systems, the 1G x 8 AS4C1G8MD3L offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.

Key Specifications and Benefits:

Internally configured as eight banks of 1G x 8 bits
Offered in the 78-ball, 9-mm by 13.2-mm FBGA package
Extremely fast transfer rates of up to 1600 Mbps/pin
Clock rates of 800 MHz
Operates from a single +1.35-V power supply
Available with an extended commercial temperature range of 0 °C to +95 °C (AS4C1G8MD3L-12BCN)
Fast 64-ms, 8192-cycle refresh from 0 °C to +85 °C and 32 ms from +85 °C to +95 °C
Fully synchronous operation
Programmable read or write burst lengths of 4 or 8
Auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence
Easy-to-use refresh functions include auto- or self-refresh
Programmable mode register allows the system to choose the most suitable modes to maximize performance
Lead (Pb)-free

Target Applications:

Industrial, medical, networking, telecom, and aerospace applications

DISCONTINUED MICRON SEMICONDUCTOR LEAD (PB)-BEARING DDR, DDR2, AND SDR SDRAMS Available

Karl Kruse is now selling Alliance Memorys and offer the following Micron Semiconductor lead (Pb)-bearing double data rate (DDR), double data rate 2 (DDR2), and single data rate (SDR) devices that Micron discontinued with Micron PCN #31396 (last time buy: April 15, 2015; last time ship: Nov. 30, 2015).

With the addition of these devices, Alliance Memory now offers a wide range of lead-bearing Micron devices, including 64M, 128M, 256M, and 512M SDR SDRAMs; 256M and 512M DDR SDRAMs; and 2G DDR2 SDRAMs. The devices are available in a variety of configurations, packages, and voltages, and are offered in commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges.

To order samples, please send E-mail to info@kruse.de

Micron Semiconductor Description
part number
MT46V16M16TG-5B:MTR DDR1, 256M, 16M X 16, TSOP, commercial temperature, leaded, tape-and-reel
MT46V16M16TG-5B IT:M DDR1, 256M, 16M X 16, TSOP, industrial temperature, leaded
MT46V32M16CV-5B IT:J DDR1, 512M, 32M X 16, 84 BGA, industrial temperature, leaded
MT46V32M16TG-5B IT:JTR DDR1, 512M, 32M X 16, TSOP, industrial temperature, leaded, tape-and-reel
MT46V32M16TG-5B IT:J DDR1, 512M, 32M X 16 TSOP, industrial temperature, leaded
MT46V64M8CV-5B IT:J DDR1, 512M, 64M X 8, 84-ball BGA, industrial temperature, leaded
MT47H128M8CF-3:H DDR2, 1G, 128M X 8, 1.8V, 60-ball BGA, 400MHZ, commercial temperature, ROHS
MT47H128M16PK-25E IT:C DDR2, 2G, 128M X 16, 84-pin BGA, industrial temperature, leaded
MT47H128M16PK-25E IT:CTR DDR2, 2G, 128M X 16, 84-pin BGA, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2F4-6A IT:GTR SDRAM, 256M, 16M X 16, 54-ball BGA, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2F4-6A:G SDRAM, 256M, 16M X 16, 54-ball BGA, commercial temperature, leaded
MT48LC16M16A2F4-6A:GTR SDRAM, 256M, 16M X 16, 54-ball BGA, commercial temperature, leaded, tape-and-reel
MT48LC16M16A2TG-6A IT:GTR SDRAM, 256M, 16M X 16, 54-pin TSOP, industrial temperature, leaded, tape-and-reel
MT48LC16M16A2TG-6A:GTR SDRAM, 256M, 16M X 16, 54-pin TSOP, commercial temperature, leaded, tape-and-reel
MT48LC2M32B2TG-6A IT:J SDRAM, 64M, 2M X 32, TSOP, industrial temperature, leaded
MT48LC2M32B2TG-6A IT:JTR SDRAM, 64M, 2M X 32, TSOP, industrial temperature, leaded, tape-and-reel
MT48LC2M32B2TG-6A:J SDRAM, 64M, 2M X 32, TSOP, commercial temperature, leaded
MT48LC32M16A2TG-75:C SDR, 512M, 32M X 16, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature
MT48LC32M16A2TG-75:CTR SDR, 512M, 32M X 16, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature, tape-and-reel
MT48LC4M32B2TG-6A:L SDRAM, 128M, 4M X 32, TSOP, commercial temperature, leaded
MT48LC4M32B2TG-6A IT:L SDRAM, 128M, 4M X 32, TSOP, industrial temperature, leaded
MT48LC64M8A2TG-75 IT:C SDR, 512M, 64M X 8, 3.3 V, 54-pin TSOP II, 133 MHz, industrial temperature
MT48LC64M8A2TG-75:C SDR, 512M, 64M X 8, 3.3 V, 54-pin TSOP II, 133 MHz, commercial temperature
MT48LC8M16A2TG-6A:L SDRAM, 128M, 8M X 16, TSOP, commercial temperature, leaded
MT48LC8M16A2TG-6A:LTR SDRAM, 128M, 8M X 16, TSOP, commercial temperature, leaded, tape-and-reel

CONTINUING SUPPORT FOR MUST-HAVE MICRON 512-MB SDRAMS

It’s more than two years since Alliance landmark agreement with Micron to extend availability of the popular MT48LC32M16 and MT48LC64M8 512-Mb DRAMs. They will continue to support these products with their original part numbers through 2017. Alliance have released drop-in replacements with their own Alliance Memory part numbers, in the AS4C32M16SB family, to ensure an ongoing supply of these key devices for our customers. Request AS4C32M16SB samples now . . .

Quality Inductor Replacements For Toko/Murata, Coilcraft, Sumida, Vishay Etc.

Do you have problems with discontinued inductors (Toko EOL) or waiting long lead times (for Vishay and Sumida, up to 20 wks) ?

We have the solution.

We offer replacements for obsolete Toko/Murata (Reference the following known EOL types = TOKO 8RHB2, TOKO 8RB, TOKO 10RB, TOKO 8RBS, TOKO 8RHB2, TOKO D10F , TOKO D52FU, TOKO D73C, TOKO TYPE D10F ), Coilcraft, Sumida, Vishay etc.

Shielded Power Inductors ,Multi-Layer Ceramic Chip Inductors, Radial Peaking Coils, Open Wire-Wond Chip Inductors, Thin-Film Chip Inductors, etc.

If you need RF & Power Magnetics just click here or send us your requirements to info@kruse.de

AEM Components’ Automotive-Grade Surface-Mount Fuses Deliver Performance And Reliability Improvements

AEM Components announces the availability of its new line of AEC-Q200 qualified surface-mount fuses designed specifically for reliable operation in high-stress automotive applications. The new wire-in-air AirMatrix (QA Series) and solid body SolidMatrix (QF Series) fuses are manufactured in AEM’s TS16949-certified facility. The two product series together offer automotive design engineers with products that assure reliable performance in applications ranging from engine controls and battery-management systems to infotainment and communications systems.

The QA Series features the industry’s highest current ratings — up to 20A/250V. Its proprietary, hermetically-sealed wire-in-air structure assures consistent electrical performance The QF solid-body fuses utilize AEM’s proprietary, anti-sulfur end-cap construction and provide superior mechanical and thermal stability over a wide temperature range (-55°C to +150°C).

The fusible element in the QA Series wire-in-air devices is uniformly straight across the internal cavity and externally bonded to the endcap through the plating process .Competitive units utilize solder beads inside a ceramic tube to bond the fusible link. This traditional approach has the drawback of non-uniform performance and potential internal connection failure caused by mechanical/thermal stress like vibration or bending, or by common soldering defects like cold joints or poor wetting. Under high-stress conditions, the solder can vaporize, causing prolonged arcing that can lead to package failure and damage to the circuit board and surrounding components. In comparison, our automotive-grade fuses are designed specifically to enhance reliability in harsh environments by eliminating the solder joint.

The QA Series is offered in two fast-acting versions: a 2410 package with a 0.5-20A/65-250V rating and a 1206 package rated at 1.5-15A/32-65V. Auto-grade QF parts are offered in fast-acting and time-lag versions, and in 1206 and 0603 versions with current ratings up to 8A.